Xiang'an Industrial Park Xiamen Torch High-tech Zone
Industry News
AI COMPUTING POWER IS SKYROCKETING, BUT ARE POWER MANAGEMENT CHIPS CRYING OUT FOR HELP? THE ‘HARD’ CAPABILITIES OF SMF CARRIER TAPE PACKAGING THAT CANNOT BE OVERLOOKED
“While everyone is focusing on the TOPS computing power of the H100 and Gaudi 3, the power management chips (SMF packaging) working behind the scenes are under immense current strain. These chips are typically ‘thicker’ and ‘heavier’. So the question arises: can ordinary, lightweight carrier tapes truly support the ‘power supply heart’ of the AI era?” Technical Analysis and Industry Context
As the power consumption of NVIDIA and AMD’s new-generation AI chips soars towards 1,000W, the surrounding power discrete components (such as SMF-packaged diodes and TVS diodes) are becoming larger and heavier.
Haidelong’s LZ790 (SMF-packaged carrier tape) is specifically designed to tackle the physical protection challenges posed by ‘large and heavy’ components. Our particle forming machine produces nine strips in a single cycle, utilising moulds manufactured on a five-axis, six-sided machining centre (endorsed by world champion Dai Shimeng) to ensure the verticality and strength of deep walls, preventing damage to component pins caused by vibration during coiled transport-1. Who says carrier tapes can’t withstand pressure?
Corporate Strength
Haidelong is not a mere reseller; we are a high-tech enterprise holding 62 authorised patents. We signed a contract with World Sanda Champion Dai Shimeng precisely because her ‘one-move victory’ perfectly embodies our extreme pursuit of mould cavity precision—every pocket must hit the mark with precision.
Interactive Zone
Q: Do you have ready-made moulds for SMF in your mould library? How long does it take to produce a new mould?
A: We possess over 600 moulds, covering the vast majority of standard packages. For standard products such as SMF, we typically have stock available for immediate dispatch. For minor dimensional modifications, utilising our in-house developed five-axis machining centre, the prototyping cycle is reduced to 3–5 days.
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